Technical Capability
Consons has the capability for full lead-free manufacturing and provides support to assist our customers in their requirement on ROHS Complaint products.
PCB Technology Capability
- Base Material:FR4
- Special Material: Rogers,Arlon,Taconic,Teflon, High Temperature, Free halogen, Aluminium Based(Berquist)
- Layer Coverage: 1-12 layers
- Min. Line Width/Space: 3mils/3mils(0.076mm/0.076mm)
- Min. Annular Ring Width: 3mils(0.076mm)
- Min.Hole Size: 0.1mm
- Min.Blind-via: 0.1mm
- Min.Buried-via: 0.1mm
- Min. inner layer clearance: 0.010"
- Min. silkscreen line width: 5mil
- Min. SMD spacing 3mil: 9.6
- Mini. Pad diameter: 3mil
- Max.Board Thickness:6.0mm
- Aspect Ratio≤ 10:1
- Max.Board Size:Double size:600*900mm,Multilayers 500*800mm
- Surface Technique:immersion gold,HASL,HASL Lead-free,Immertion Tin,Electrolytic Ni/Au,Gold finger,OSP
- Finished copper weight from 0.5oz to 4oz
PCBA Technology Capability
- Smallest chip placement:0201
- Automated axial insertion and Automated radial insertion
- Computer controlled Pb free wave soldering system
- High speed Pb free surface mount production lines
- Providing electronic components purchase service for the customers
- ICT on line inspection, PCBA function test equipment, Visual inspection
Mould And Box build Service
- Box Build
- Plastic injection
- Finish Packaging
Production Capability
- Factory:5000jobs/Month
- SMT: 7,000,000 Points/Day
- Auto DIP:3,500,000 Points/Day
Testing Tool Equipment
