CNS003
Mobile Board Assembly
0201 placement
IC precision: 0.4mm pinch distance
BGA precision: 0.4mm globe center distance
Type of productions:
- SMT and though-hole
- BGA and COB
- Plastic injection
- Die-casting
- Sheet metal stamping
- X-ray and ICT test
Reply to your inquiries via Email within 2 hours; provide the quotations in 2 to 3 working days
Professional engineering staff to provide technical support before and after sales
With IPC 610 manufacturing standards and other international standards
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