CNS006

Lead-free Technology SMT Process
  • PCB design, layout, fabrication, assembly and function test
  • 0402 placement
  • IC precision: 0.4mm
  • Lead-free technology SMT process
  • Up to 22 layers mixed assembly technology used on communications
  • Specialized in assembling boards for Network and communication, industry control
  • Type of productions:
    • SMT, though-hole
    • BGA and COB
    • Plastic injection
    • Die-casting
    • Sheet metal stamping
    • X-ray and ICT test
    • Within two hours to reply the inquiry such as E-mail, two to three working days to provide the quotations
    • Professional engineering staff to provide technical support before and after sales
    • With IPC610 manufacturing and other international standards
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