CNS004

Power Boards with Lead-Free Though-Hole Technology, Available in Various Specification

 

  • PCB design, layout, fabrication, assembly and function test
  • 0201 placement
  • BGA precision: 0.5mm
  • IC precision: 0.4mm
  • Experienced components sourcing team
  • Specially for scarce parts
  • Power boards with lead free though-hole technology
  • Up to 22 layers mixed assembly technology used on communications
  • Specialized in assembling boards for network and communications
  • Industry control
  • Type of productions:
    • SMT
    • BGA and COB
    • Plastic injection
    • Die-casting
    • Sheet metal stamping
    • X-ray and ICT test
    • Professional engineering staff to provide technical support
    • With IPC610 manufacturing and other international standards
  • OEM and ODM services are also welcome
back